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Title:
ADHESIVE COMPOSITION CONTAINING A DIMER DIOL COPOLYMER POLYIMIDE URETHANE RESIN
Document Type and Number:
WIPO Patent Application WO/2020/158360
Kind Code:
A1
Abstract:
An adhesive composition is provided which has excellent adhesion, excellent moist solder heat resistance, and excellent low dielectric properties.　As the copolymer components, this polyimide urethane resin (A) contains polycarboxylic acid derivative component (a1) having an acid anhydride group, a dimer diol component (a2), and an isocyanate component (a3).

More Like This:
WO/2009/043099HIGH MODULUS POLYURETHANE AND POLYURETHANE/UREA COMPOSITIONS
WO/2021/009252ONE-PACK POLYURETHANE DISPERSIONS, THEIR MANUFACTURE AND USE
Inventors:
KANDA RYOSUKE (JP)
IRISAWA HAYATO (JP)
Application Number:
PCT/JP2020/000800
Publication Date:
August 06, 2020
Filing Date:
January 14, 2020
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G18/34; C09J163/00; C09J175/04; H05K1/03; H05K3/38
Foreign References:
JP2017031301A2017-02-09
JP2018123269A2018-08-09
JPS6365755B21988-12-16
JP2001011420A2001-01-16
JP2000198855A2000-07-18
JP2002212517A2002-07-31
JP2017036407A2017-02-16
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