ADHESIVE COMPOSITION CONTAINING RESIN HAVING CARBON-CARBON MULTIPLE BOND

WIPO Patent Application WO/2012/020655

A1

[Problem] To provide a highly heat-resistant adhesive composition, which easily dissolves in various organic solvents, has good coating properties, and can form an adhesive layer having a sufficient thickness, wherein the adhesive layer shows very low thermal weight loss in a high-temperature process such as a step of bonding through metal bumps, CVD, or ion diffusion, and has good adhesiveness. [Solution] An adhesive composition comprising a polymer which contains a unit structure represented by formula (1) (wherein L1 represents an arylene group or a combination of an arylene group with a sulfonyl group or a carbonyl group; and T1 represents a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group which may have a substituent with a fluoroalkylene group or a cyclic alkylene group), and has at least one group having either or both of structures of formulae (2-A) and (2-B) at an end or in a side chain or a main chain thereof.

OGINO HIROSHI (JP)
TAMURA MAMORU (JP)
ENOMOTO TOMOYUKI (JP)

PCT/JP2011/067466

February 16, 2012

July 29, 2011

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NISSAN CHEMICAL IND LTD (JP)
OGINO HIROSHI (JP)
TAMURA MAMORU (JP)
ENOMOTO TOMOYUKI (JP)

C09J171/08; B32B27/00; C08G65/40

JPH04233939A	1992-08-21
JP2003231750A	2003-08-19
JP2005264008A	2005-09-29
JPS62501370A	1987-06-04
JPH06322255A	1994-11-22
JP2010280781A	2010-12-16

HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)

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