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Title:
ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/116967
Kind Code:
A1
Abstract:
This adhesive composition is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more kinds of epoxy compounds.

Inventors:
HIRAKAWA MAKOTO (JP)
YAMADA MASASHI (JP)
Application Number:
JP2017/045038
Publication Date:
June 28, 2018
Filing Date:
December 15, 2017
Export Citation:
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Assignee:
TOAGOSEI CO LTD (〒1058419, JP)
International Classes:
C09J123/26; B32B15/085; B32B27/00; C09J7/00; C09J11/06; C09J123/10; C09J151/00; C09J163/00; C09J163/04
Domestic Patent References:
WO2015190411A12015-12-17
WO2016042837A12016-03-24
WO2016047289A12016-03-31
Foreign References:
JP5700166B12015-04-15
JP2007251138A2007-09-27
JP2016089090A2016-05-23
JPH1060401A1998-03-03
JP2014208764A2014-11-06
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