Title:
ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/116967
Kind Code:
A1
Abstract:
This adhesive composition is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more kinds of epoxy compounds.
Inventors:
HIRAKAWA MAKOTO (JP)
YAMADA MASASHI (JP)
YAMADA MASASHI (JP)
Application Number:
PCT/JP2017/045038
Publication Date:
June 28, 2018
Filing Date:
December 15, 2017
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J123/26; B32B15/085; B32B27/00; C09J7/00; C09J11/06; C09J123/10; C09J151/00; C09J163/00; C09J163/04
Domestic Patent References:
| WO2015190411A1 | 2015-12-17 | |||
| WO2016042837A1 | 2016-03-24 | |||
| WO2016047289A1 | 2016-03-31 |
Foreign References:
| JP5700166B1 | 2015-04-15 | |||
| JP2007251138A | 2007-09-27 | |||
| JP2016089090A | 2016-05-23 | |||
| JPH1060401A | 1998-03-03 | |||
| JP2014208764A | 2014-11-06 |
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