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Title:
ADHESIVE COMPOSITION, AND COVERLAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/147903
Kind Code:
A1
Abstract:
Provided is an adhesive composition having good adhesiveness to polyimide film and other such insulating films and having excellent dielectric properties. An adhesive composition containing: a styrenic elastomer (A) containing a carboxyl group; and an epoxy resin (B); the adhesive composition being characterized in that the content of the epoxy resin (B) is 1-20 parts by mass per 100 parts by mass of the styrenic elastomer (A) containing a carboxyl group, and the dielectric constant of the cured adhesive measured at a frequency of 1 GHz is less than 2.5.

Inventors:
OKIMURA Yuya (C/O TOAGOSEI CO. LTD, 8, Showa-cho, Minato-ku, Nagoya-sh, Aichi 26, 〒4550026, JP)
YAMADA Masashi (C/O TOAGOSEI CO. LTD, 8, Showa-cho, Minato-ku, Nagoya-sh, Aichi 26, 〒4550026, JP)
Application Number:
JP2013/083245
Publication Date:
September 25, 2014
Filing Date:
December 11, 2013
Export Citation:
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Assignee:
TOAGOSEI CO., LTD. (1-14-1, Nishi-Shimbashi Minato-k, Tokyo 19, 〒1058419, JP)
International Classes:
C09J125/08; B32B27/00; B32B27/34; C09J7/02; C09J153/00; C09J163/00; H05K3/38
Foreign References:
JP2002088332A2002-03-27
JP2002235061A2002-08-23
JP2004075853A2004-03-11
JPH05186747A1993-07-27
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