Title:
ADHESIVE COMPOSITION, CURED OBJECT, ELECTRONIC COMPONENT, AND ASSEMBLY COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/030434
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an adhesive composition which has excellent adhesiveness and which facilitates low-temperature reworking. Another purpose of the present invention is to provide a cured object obtained from the adhesive composition and an electronic component and an assembly component both including a cured object obtained from the adhesive composition. The adhesive composition of the present invention comprises a moisture-curable resin and a blowing agent.
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Inventors:
TAMAGAWA TOMOKAZU (JP)
KIDA TAKUMI (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
KIDA TAKUMI (JP)
YUUKI AKIRA (JP)
TAKAHASHI TORU (JP)
Application Number:
PCT/JP2017/028836
Publication Date:
February 15, 2018
Filing Date:
August 08, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J4/00; C09J11/06; C09J175/04
Domestic Patent References:
| WO2016104787A1 | 2016-06-30 |
Foreign References:
| JP2003286465A | 2003-10-10 | |||
| JP2004051701A | 2004-02-19 | |||
| JP2005263857A | 2005-09-29 | |||
| JP2012153835A | 2012-08-16 | |||
| JP2015183162A | 2015-10-22 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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