Title:
ADHESIVE COMPOSITION, CURED PRODUCT, AND HEAT-PEELABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/037914
Kind Code:
A1
Abstract:
Provided is an adhesive composition suitable for a heat-peelable adhesive sheet that has sufficiently high peel strength from an adherend, can be peeled easily from the adherend through heating after process completion, and does not contaminate the adherend surface. The adhesive composition according to the present invention contains an unsaturated polyurethane (A), an ethylenic-unsaturated-group-containing monomer (B), thermally expansive particles (C), and a photopolymerization initiator (D). The adhesive composition according to the present invention does not contain an ethylenic-unsaturated-group-containing monomer (B'). The weight-average molecular weight of the unsaturated polyurethane (A) is 10,000-200,000, and the ethylenic-unsaturated-group-containing monomer (B) includes one ethylenic unsaturated group. The ethylenic-unsaturated-group-containing monomer (B') includes two or more ethylenic unsaturated groups.
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Inventors:
IKEYA TATSUHIRO (JP)
SASAKI KAZUHIRO (JP)
NAKANISHI KENICHI (JP)
SASAKI KAZUHIRO (JP)
NAKANISHI KENICHI (JP)
Application Number:
PCT/JP2022/032336
Publication Date:
March 16, 2023
Filing Date:
August 29, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J4/02; C09J7/38; C09J11/06; C09J11/08; C09J175/04
Domestic Patent References:
| WO2020196755A1 | 2020-10-01 | |||
| WO2020196757A1 | 2020-10-01 | |||
| WO2020196758A1 | 2020-10-01 |
Foreign References:
| JP2012052038A | 2012-03-15 | |||
| JP2012056985A | 2012-03-22 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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