Title:
ADHESIVE COMPOSITION, CURED PRODUCT, LAMINATE, AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/212257
Kind Code:
A1
Abstract:
Provided is an adhesive composition which is cured at low temperatures and is capable of forming a cured product that has excellent insulating properties, heat resistance and adhesiveness. An adhesive composition according to the present invention contains a polyorganosilsesquioxane (A) which has a constituent unit represented by formula (1), and wherein: the proportion of the constituent unit represented by formula (1) and the constituent unit represented by formula (2) relative to the total amount of siloxane constituent units (100 mol%) is 55-100 mol%; the number average molecular weight is from 1,500 to 50,000; and the degree of molecular weight dispersity ((weight average molecular weight)/(number average molecular weight)) is from 1.0 to 4.0.
R1SiO3/2 (1)
(In formula (1), R1 represents a group containing a radically polymerizable group.)
R1SiO2
/2(OR2) (2)
(In formula (2), R1 is as defined above, and R2 represents a hydrogen atom or an alkyl group having 1-4 carbon atoms.)
Inventors:
SHIBAMOTO AKIHIRO (JP)
MAETANI SHINJI (JP)
NISHIDA KAZUHIRO (JP)
USA DAISUKE (JP)
YAMAKAWA AKIRA (JP)
TSUJI NAOKO (JP)
MAETANI SHINJI (JP)
NISHIDA KAZUHIRO (JP)
USA DAISUKE (JP)
YAMAKAWA AKIRA (JP)
TSUJI NAOKO (JP)
Application Number:
PCT/JP2018/018998
Publication Date:
November 22, 2018
Filing Date:
May 16, 2018
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C09J183/07; B32B27/00; C08G77/20; C09J5/06; C09J11/06
Domestic Patent References:
WO2015030116A1 | 2015-03-05 | |||
WO2016204114A1 | 2016-12-22 |
Foreign References:
JP2015096559A | 2015-05-21 | |||
JP2017008148A | 2017-01-12 | |||
JP2016511784A | 2016-04-21 | |||
JP2014177632A | 2014-09-25 | |||
JP2017098511A | 2017-06-01 | |||
JP2017098513A | 2017-06-01 | |||
JP2009279840A | 2009-12-03 | |||
JP2010226060A | 2010-10-07 |
Other References:
See also references of EP 3626796A4
Attorney, Agent or Firm:
GOTO & CO. (JP)
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