Title:
ADHESIVE COMPOSITION, CURED PRODUCT, AND PRECISION PART
Document Type and Number:
WIPO Patent Application WO/2018/008462
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive composition having a long pot life, it being possible to cure said composition at a lower temperature than in precuring when used in the two stages of precuring and curing. [Solution] An adhesive composition containing a radical-polymerizable curable resin, an organic peroxide having a one-minute half-life temperature of less than 100°C, and a radical polymerization inhibitor. Said composition has a viscosity increase of 1.5 or less after 48 hours at 25°C. Said composition can be precured by heating for 1-5 seconds at 100-180°C, and can be cured by heating at 70-100°C after precuring.
Inventors:
ARAI KATSUNORI (JP)
Application Number:
PCT/JP2017/023505
Publication Date:
January 11, 2018
Filing Date:
June 27, 2017
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C09J4/00; C09J11/04; C09J11/06
Domestic Patent References:
WO2013005471A1 | 2013-01-10 |
Foreign References:
JP2006045459A | 2006-02-16 | |||
JP2016044268A | 2016-04-04 | |||
JP2000080252A | 2000-03-21 |
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
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