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Title:
ADHESIVE COMPOSITION, CURED PRODUCT, AND SURFACE PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/139000
Kind Code:
A1
Abstract:
The present invention provides a means for enabling the formation of an adhesive layer in which adhesiveness and reworkability are highly reconciled by reducing adhesiveness during peeling to be lower than adhesiveness in an adhered state. In addition, the present invention provides a means capable of reconciling adhesiveness and reworkability, improving the punching processability of an adhesive layer, reducing the substrate contamination thereof, lowering the peeling static voltage of the adhesive layer, and improving the wettability of the adhesive layer to a product to be adhered. The present invention relates to an adhesive composition comprising: an (A) component, which is a urethane prepolymer having two or more hydroxyl groups; a (B) component, which is a multifunctional (meth)acrylate; a (C) component, which is a cross-linking agent; a (D) component, which are cross-linking particles; a (E) component, which is a photoradical initiator; and an (F) component, which is an antistatic agent, wherein the amount of the (D) component is approximately 0.01-10 parts by weight on the basis of 100 parts by weight of the (A) component.

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Inventors:
TOSHIYUKI TAKAHASHI (JP)
TATSUHIRO SUWA (JP)
Application Number:
PCT/KR2019/018566
Publication Date:
July 02, 2020
Filing Date:
December 27, 2019
Export Citation:
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Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C09J175/08; C08F283/00; C08G18/10; C08G18/48; C09J7/22; C09J7/30
Foreign References:
JP2016030766A2016-03-07
JP2009035635A2009-02-19
JP2001019911A2001-01-23
JPH0827239A1996-01-30
JP2014025073A2014-02-06
Attorney, Agent or Firm:
AJU INTERNATIONAL LAW & PATENT GROUP (KR)
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