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Title:
ADHESIVE COMPOSITION FOR DECORATIVE FILM
Document Type and Number:
WIPO Patent Application WO/2021/049480
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to an adhesive composition for a decorative film, the decorative film, or a decorative molded body. The adhesive composition for a decorative film includes a (meth)acrylic polymer (A) that satisfies the following conditions (I) and (II), has a weight-average molecular weight of 300,000 or less as measured using a GPC method, and has a glass transition temperature of greater than 0°C and less than 50°C as obtained from the peak temperature of the tanδ measured using a dynamic viscoelasticity measurement method, wherein in relation to the total 100 mass% of the polymer (A) and a (meth)acrylic polymer (Ah) having a glass transition temperature greater than or equal to 50°C, the polymer (Ah) content is less than 25 mass%. (I) The polymer (A) is a polymer of a monomer component including 19 mass% or more of a monomer (a1) that does not have a crosslinking functional group. (II) A homopolymer of the monomer (a1) has a glass transition temperature greater than or equal to 0°C.

Inventors:
YOSHIKAWA MIDORI (JP)
YONEKAWA YUYA (JP)
Application Number:
PCT/JP2020/033925
Publication Date:
March 18, 2021
Filing Date:
September 08, 2020
Export Citation:
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Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
B32B27/00; C09J7/38; C09J133/04
Foreign References:
JP2012077177A2012-04-19
JP2016207900A2016-12-08
JP2003003136A2003-01-08
JP2011231218A2011-11-17
JP2007197668A2007-08-09
JP2019073641A2019-05-16
Other References:
"Polymer Handbook", 2003, WILEY-INTERSCIENCE
See also references of EP 4029693A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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