ADHESIVE COMPOSITION, DIE ATTACH MATERIAL, SEALING AGENT OR COATING AGENT FOR PROTECTION, AND ELECTRICAL/ELECTRONIC COMPONENT

WIPO Patent Application WO/2022/075245

A1

This perfluoropolyether-based adhesive composition contains: (A) a linear perfluoropolyether compound containing two or more alkenyl groups in one molecule and having a number average molecular weight of 2,000 or more and a mass reduction rate of 1% or less when heated at 150 °C for 1 hour; (B) a fluorine-containing organohydrogen polysiloxane compound which contains at least one fluorine-containing organic group, and does not contain an epoxy group and a trialkoxysilyl group, and which has a number average molecular weight of 1,000-4,000 and a mass reduction rate of 20% or less when heated at 150 °C for 1 hour; (C) a platinum group metal compound; and (D) an organohydrogen polysiloxane compound which contains at least one of each of an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a carbon atom or a carbon atom and a hydrogen atom, and which has a number average molecular weight of 700 or more, wherein the perfluoropolyether-based adhesive composition is used to provide a cured product of a fluorine-containing elastomer which has decreased contamination of peripheral parts caused by an outgas generated during heat-curing.

HAYASHI RYUTO (JP)
KOSHIKAWA HIDENORI (JP)
FUKUDA KENICHI (JP)

PCT/JP2021/036571

April 14, 2022

October 04, 2021

Click for automatic bibliography generation  

SHINETSU CHEMICAL CO (JP)

C09J11/06; C09J171/02; C09J183/05; C09J183/06; C09J183/07; H01L21/52; H01L23/29; H01L23/31

JP2005126618A	2005-05-19
JP2019006969A	2019-01-17
JP2018123206A	2018-08-09
JPH0995615A	1997-04-08
JP4582287B2	2010-11-17
JPH0995615A	1997-04-08

PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: STATUS DETERMINATION DEVICE AND STATUS DETERMINATION METHOD

Next Patent: TRANSMISSION CIRCUIT