Title:
ADHESIVE COMPOSITION FOR ELECTROCHEMICAL ELEMENT, ADHESIVE LAYER FOR ELECTROCHEMICAL ELEMENT, AND ELECTROCHEMICAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2016/051674
Kind Code:
A1
Abstract:
The objective of the present invention is to provide an adhesive composition for an electrochemical element, the composition having excellent adhesion in a liquid electrolyte, and making it possible to form an adhesive layer that is additionally capable of improving the electrochemical characteristics of the electrochemical element. This adhesive composition can be used to create adhesion between an electrode assembly and a casing. This adhesive composition contains organic particles having a core-shell structure provided with a core section and a shell section partially covering the outer surface of the core section, the degree of electrolyte swelling of the polymer in the core section being 500 to 3000%, and the degree of electrolyte swelling of the polymer in the shell section being greater than 100% and no more than 400%.
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Inventors:
SASAKI TOMOKAZU (JP)
Application Number:
PCT/JP2015/004530
Publication Date:
April 07, 2016
Filing Date:
September 07, 2015
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C09J11/08; C09J201/00; H01G11/82; H01M10/04; H01M50/119; H01M50/121; H01M50/124; H01M50/133
Domestic Patent References:
| WO2013080946A1 | 2013-06-06 | |||
| WO2011001848A1 | 2011-01-06 |
Foreign References:
| JP2006092847A | 2006-04-06 | |||
| JP2015028842A | 2015-02-12 |
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
Kenji Sugimura (JP)
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