Title:
ADHESIVE COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/130043
Kind Code:
A1
Abstract:
The adhesive composition according to the present invention comprises a radical polymerizable compound and a photoradical polymerization initiator and satisfies requirements (1) and (2) [wherein: Tga stands for the tanδ peak temperature in the dynamic viscoelasticity measurement of a cured product that is prepared by curing the adhesive composition in the presence of oxygen; and Tgb stands for the tanδ peak temperature in the dynamic viscoelasticity measurement of a cured product that is prepared by curing the adhesive composition in the absence of oxygen]. Requirement (1) |Tgb-Tga|≤30°C, Requirement (2) -15°C≤Tga≤35°C According to the present invention, an adhesive composition having high initial bond strength and good shape retention properties can be provided.
Inventors:
KAWADA SHINJI (JP)
SHIOJIMA MOTOMI (JP)
SHIOJIMA MOTOMI (JP)
Application Number:
PCT/JP2019/049630
Publication Date:
June 25, 2020
Filing Date:
December 18, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/00; C09J11/06
Domestic Patent References:
| WO2016163152A1 | 2016-10-13 | |||
| WO2016163153A1 | 2016-10-13 | |||
| WO2019073979A1 | 2019-04-18 | |||
| WO2017183333A1 | 2017-10-26 | |||
| WO2019069872A1 | 2019-04-11 |
Foreign References:
| JP2015108115A | 2015-06-11 | |||
| JP2016089174A | 2016-05-23 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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