Title:
ADHESIVE COMPOSITION, FILM ADHESIVE, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149277
Kind Code:
A1
Abstract:
The present disclosure provides an adhesive composition. The adhesive composition contains an epoxy resin, a first curing agent that has a softening point of at least 90°C, a second curing agent that has a softening point of less than 90°C, and an elastomer. The present disclosure also discloses a film adhesive that uses the adhesive composition, a dicing/die-bonding all-in-one film, a semiconductor device, and a production method for the semiconductor device.
Inventors:
KUNITO YUI (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
NAKAMURA KANAMI (JP)
YAMAMOTO KAZUHIRO (JP)
AOYAGI SHOTA (JP)
Application Number:
PCT/JP2021/000553
Publication Date:
July 14, 2022
Filing Date:
January 08, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/04; C09J7/10; C09J7/20; C09J11/08; C09J163/00; H01L21/52
Foreign References:
| JP2013256574A | 2013-12-26 | |||
| JP2014175459A | 2014-09-22 | |||
| JP2009231469A | 2009-10-08 | |||
| JP2011052109A | 2011-03-17 | |||
| JP2018526808A | 2018-09-13 | |||
| JP2009124115A | 2009-06-04 | |||
| JP2016222838A | 2016-12-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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