Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/136286
Kind Code:
A1
Abstract:
An adhesive composition that contains (A) an epoxy resin and (B) a curing agent, in which a pyridinium salt is included as the (B) component, the pyridinium salt includes a pyridinium cation and an anion, the pyridinium cation has a benzyl group at the 1-position and an electron-attracting group at the 2-position, the benzyl group has an electron-donating group, and the anion is B(C6F5)4
- or B(C6H3(CF3)2)4
- (wherein the CF3 group is substituted at the 3- and 5-positions of a phenyl group).
Inventors:
MORIYA TOSHIMITSU (JP)
YAMAZAKI YUTA (JP)
ISHIKAWA KAZUNORI (JP)
KOBAYASHI RYOHTA (JP)
ITO TSUBASA (JP)
YAMAZAKI YUTA (JP)
ISHIKAWA KAZUNORI (JP)
KOBAYASHI RYOHTA (JP)
ITO TSUBASA (JP)
Application Number:
PCT/JP2023/000595
Publication Date:
July 20, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
SIKA HAMATITE CO LTD (JP)
SIKA HAMATITE CO LTD (JP)
International Classes:
C09J9/02; C09J7/30; C09J11/06; C09J163/00; H01B1/20; H05K1/03
Foreign References:
| JPH09194816A | 1997-07-29 | |||
| JPH05262813A | 1993-10-12 | |||
| JPH055006A | 1993-01-14 | |||
| JPH03109465A | 1991-05-09 | |||
| JPH01299803A | 1989-12-04 | |||
| JP2022164657A | 2022-10-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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