Title:
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING SAME ADHESIVE COMPOSITION, CONNECTION STRUCTURE FOR CIRCUIT MEMBER AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2013/018152
Kind Code:
A1
Abstract:
The present invention provides an adhesive composition comprising (A) an organic aluminum complex, (B) a silane coupling agent, and (C) a curing component.
Inventors:
KAWAKAMI SUSUMU (JP)
Application Number:
PCT/JP2011/067387
Publication Date:
February 07, 2013
Filing Date:
July 29, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KAWAKAMI SUSUMU (JP)
KAWAKAMI SUSUMU (JP)
International Classes:
C09J201/00; C09J4/00; C09J7/00; C09J11/06; H01B1/20; H01L31/042; H01R4/04; H01R11/01
Domestic Patent References:
| WO2006118181A1 | 2006-11-09 | |||
| WO2004039856A1 | 2004-05-13 |
Foreign References:
| JP2002212537A | 2002-07-31 | |||
| JPH11343474A | 1999-12-14 | |||
| JP2010283059A | 2010-12-16 | |||
| JP2011091327A | 2011-05-06 | |||
| JP2006199825A | 2006-08-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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