Title:
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/016305
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition containing (A) a thermoplastic resin having a Tg of not more than 100˚C and (B) a thermosetting component. The thermosetting component (B) contains (B1) a compound having an allyl group and (B2) a compound having a maleimide group.
Inventors:
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
KATOGI SHIGEKI (JP)
Application Number:
PCT/JP2009/058502
Publication Date:
February 11, 2010
Filing Date:
April 30, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
MASUKO TAKASHI (JP)
KATOGI SHIGEKI (JP)
International Classes:
C09J4/00; C09J7/20; C09J11/04; C09J163/00; C09J179/08; C09J201/00; H01L21/02; H01L21/301; H01L21/52
Domestic Patent References:
| WO2007083810A1 | 2007-07-26 |
Foreign References:
| JPH03192178A | 1991-08-22 | |||
| JPH04234472A | 1992-08-24 | |||
| JPH0917810A | 1997-01-17 | |||
| JPH04196246A | 1992-07-16 | |||
| JPH0314578B2 | 1991-02-27 |
Other References:
K. AMBIKA DEVI; C.P. REGHUNADHAN NAIR; K.N. NINAN, J. APPL. POLYM. SCI., vol. 106, 2007, pages 1192
See also references of EP 2311921A4
See also references of EP 2311921A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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