ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, DICING/DIE-BONDING INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SAME

Title:

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, DICING/DIE-BONDING INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2021/002248

Kind Code:

A1

Abstract:

Disclosed is an adhesive composition containing an epoxy resin, a curing agent, an elastomer, and a filler, wherein the elastomer comprises a polyurethane resin.

Inventors:

HIRAMOTO YUYA (JP)
NATSUKAWA MASANORI (JP)
UEDA ASAMI (JP)

Application Number:

PCT/JP2020/024650

Publication Date:

January 07, 2021

Filing Date:

June 23, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

C09J163/00; C09J7/30; C09J11/06; C09J11/08; C09J161/04; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18

Domestic Patent References:

WO2012160916A1	2012-11-29
WO2018235854A1	2018-12-27

Foreign References:

JP2012241134A	2012-12-10
US20110070436A1	2011-03-24
JP2019077758A	2019-05-23
CN104449513A	2015-03-25

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: DIFFUSION MEMBER, LAMINATE, DIFFUSION MEMBER SET, LED BACKLIGHT, AND DISPLAY DEVICE

Next Patent: MANUFACTURING METHOD OF TRAINED WORK CLASSIFICATION ESTIMATION MODEL, DATA FOR TRAINING, METHOD EXEC...