Title:
ADHESIVE COMPOSITION, ADHESIVE FILM AND METHOD FOR PRODUCING THE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/029581
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure and a (meth)acrylic acid alkyl ester having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesion strength under high temperature conditions, alkali resistance, and easy releasability after a high-temperature process. Consequently, there can be obtained an adhesive composition having high heat resistance, adhesion strength under high temperature conditions, alkali resistance, and easy releasability after a high-temperature process.
Inventors:
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
SAITO KOJI
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
SAITO KOJI
Application Number:
PCT/JP2007/065285
Publication Date:
March 13, 2008
Filing Date:
August 03, 2007
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
SAITO KOJI
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
SAITO KOJI
International Classes:
C09J125/14; C09J7/02; C09J133/08; C09J135/06
Domestic Patent References:
| WO2007049566A1 | 2007-05-03 |
Foreign References:
| JP2002206042A | 2002-07-26 | |||
| JP2001115124A | 2001-04-24 | |||
| JPH07268037A | 1995-10-17 | |||
| JPH023483A | 1990-01-09 | |||
| JP2005314453A | 2005-11-10 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita, Kita-k, Osaka-shi Osaka 41, JP)
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