Title:
ADHESIVE COMPOSITION AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2008/062603
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition mainly composed of a polymer which is obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and a (meth)acrylic acid alkyl ester having a chain structure. Since the monomer composition further contains a carboxylic acid having an ethylenic double bond, a bifunctional monomer and a styrene macromonomer, and the polymer has a styrene block segment, the adhesive composition is improved in heat resistance, adhesive strength under high temperature conditions, alkali resistance, and easiness of release after a high-temperature process. Consequently, there can be provided an adhesive composition having high heat resistance, adequate adhesive strength under high temperature conditions and adequate alkali resistance, which can be easily released after a high-temperature process.
Inventors:
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
Application Number:
PCT/JP2007/068668
Publication Date:
May 29, 2008
Filing Date:
September 26, 2007
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
ASAI TAKAHIRO
MISUMI KOICHI
MIYANARI ATSUSHI
INAO YOSHIHIRO
NAKAMURA AKIHIKO
International Classes:
C08F290/04; C09J153/00; C09J7/02; C09J155/00
Foreign References:
| JP2007119646A | 2007-05-17 | |||
| JP2001115124A | 2001-04-24 | |||
| JPH08319464A | 1996-12-03 | |||
| JPH07233356A | 1995-09-05 | |||
| JP2003313518A | 2003-11-06 | |||
| JPH023483A | 1990-01-09 | |||
| JP2002206042A | 2002-07-26 | |||
| JPH07268037A | 1995-10-17 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita, Kita-k, Osaka-shi Osaka 41, JP)
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