Title:
ADHESIVE COMPOSITION FOR FIXING MOVABLE COMPONENT, OPTICAL COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/138070
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an adhesive composition for fixing movable components which has excellent adhesiveness to both metals and non-metals, can be cured at low temperatures, and can prevent the movable components from shifting from the original positions. Another purpose of the present invention is to provide an optical component, an electronic component, and an electronic module all obtained using the adhesive composition for fixing movable components. The adhesive composition for fixing movable components of the present invention comprises a poly(vinyl acetal) resin, a compound having an epoxy group and/or a (meth)acryloyl group, and a polymerizable hardener and gives cured objects having a 25°C storage modulus of 1.0 GPa or greater.
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Inventors:
HAYASHI HIDEYUKI (JP)
Application Number:
PCT/JP2019/050585
Publication Date:
July 02, 2020
Filing Date:
December 24, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/00; C09J11/06; C09J129/14; C09J163/00
Foreign References:
| JP2017110128A | 2017-06-22 | |||
| JP2017137376A | 2017-08-10 | |||
| JP2012067221A | 2012-04-05 | |||
| JPH10501898A | 1998-02-17 | |||
| JP2016125042A | 2016-07-11 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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