Title:
ADHESIVE COMPOSITION AND HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2017/073153
Kind Code:
A1
Abstract:
Provided are an adhesive composition capable of adhering at low temperatures and a hot-melt adhesive, the adhesive composition and hot-melt adhesive having suitable adhesion to polyolefin resin base materials and polar base materials. An adhesive composition having a melting point of 70-140°C and containing an acid-modified polyolefin (A), an unfunctionalized polyolefin (B), and polyethylene (C).
Inventors:
YOKOMICHI TAKUYA (JP)
KASHIHARA KENJI (JP)
KASHIHARA KENJI (JP)
Application Number:
PCT/JP2016/074946
Publication Date:
May 04, 2017
Filing Date:
August 26, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J123/26; B32B27/00; B32B27/32; C09J123/04; C09J123/10
Domestic Patent References:
| WO2012099107A1 | 2012-07-26 |
Foreign References:
| JP2013231113A | 2013-11-14 | |||
| JP2004269688A | 2004-09-30 | |||
| JP2001098121A | 2001-04-10 |
Other References:
See also references of EP 3369795A4
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