Title:
ADHESIVE COMPOSITION INCLUDING POLYAMIDE-IMIDE RESIN
Document Type and Number:
WIPO Patent Application WO/2017/158917
Kind Code:
A1
Abstract:
Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards.
The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-compound flame retardant, wherein (A) the epoxy resin is contained in an amount of 15-40 parts by mass per 60-85 parts by mass of the polyamide-imide resin, (B) the polyamide-imide resin has a glass transition temperature of 250ºC or higher, (C) the polyamide-imide resin has an acid value of 50-150 mg-KOH/g, (D) the epoxy resin is liquid a 25ºC, (E) the phosphorus-compound flame retardant is contained in an amount of 15-60 parts by mass per 100 parts by mass of the sum of the polyamide-imide resin and the epoxy resin, and (F) 50 mass% or more of the phosphorus-compound flame retardant is accounted for by a phenanthrene type phosphinic acid derivative.
Inventors:
YANE TAKEHISA (JP)
KOYANAGI HIDEYUKI (JP)
OHRUI MANABU (JP)
EBIHARA SATOSHI (JP)
KOYANAGI HIDEYUKI (JP)
OHRUI MANABU (JP)
EBIHARA SATOSHI (JP)
Application Number:
PCT/JP2016/083155
Publication Date:
September 21, 2017
Filing Date:
November 09, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
NIPPON MEKTRON KK (JP)
NIPPON MEKTRON KK (JP)
International Classes:
C09J179/08; B32B15/088; C09J7/28; C09J7/30; C09J11/06; C09J163/00; H05K1/03
Foreign References:
| JP2006007016A | 2006-01-12 | |||
| JP5782583B1 | 2015-09-24 | |||
| JP2010116443A | 2010-05-27 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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