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Patent Searching and Data


Title:
ADHESIVE COMPOSITION FOR LABELS
Document Type and Number:
WIPO Patent Application WO/2010/113883
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition for labels, which can be relatively easily applied at low temperatures, while having good die cutting properties that contribute to improvement in the productivity of labels. The adhesive composition for labels is capable of providing a label that has excellent holding power and tack properties. Specifically disclosed is an adhesive composition for labels, which contains: a block copolymer A represented by the general formula (A) below; a polymer C which is a polymer having a glass transition temperature of -30˚C or less or a block copolymer that has a polymer block having a glass transition temperature of -30˚C or less at an end of the polymer chain; and a tackifier resin D. General formula (A): Ar1a-Da-Ar2a (In general formula (A), Ar1a represents an aromatic vinyl polymer block having a weight average molecular weight of 6,000-20,000; Ar2a represents an aromatic vinyl polymer block having a weight average molecular weight of 22,000-400,000; and Da represents a conjugated diene polymer block having a vinyl bond content of 1-20% by mole.)

Inventors:
ODA RYOUJI (JP)
HASHIMOTO SADAHARU (JP)
Application Number:
PCT/JP2010/055581
Publication Date:
October 07, 2010
Filing Date:
March 29, 2010
Export Citation:
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Assignee:
ZEON CORP (JP)
ODA RYOUJI (JP)
HASHIMOTO SADAHARU (JP)
International Classes:
C09J153/02; C09J7/02; C09J11/08; C09J201/00; G09F3/10
Domestic Patent References:
WO2009123089A12009-10-08
WO2003020825A12003-03-13
WO2004076556A12004-09-10
Foreign References:
JPH05263056A1993-10-12
JPH08283685A1996-10-29
JP2006520826A2006-09-14
JPS6366277A1988-03-24
JPH0593176A1993-04-16
US5290842A1994-03-01
JP2001504519A2001-04-03
Other References:
RUBBER CHEM. TECHNOL., vol. 45, 1972, pages 1295
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
Akihiko Yamashita (JP)
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