Title:
ADHESIVE COMPOSITION AND LAMINATE WITH ADHESIVE LAYER USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/047289
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an adhesive composition which exhibits good adhesion to a copper foil and a base film that is formed of a polyimide resin or the like, and which has excellent electrical characteristics; and a laminate with an adhesive layer, which has good storage stability of the laminate, while being suppressed in warping of the laminate in cases where the adhesive layer is in a B-stage state.
An adhesive composition according to the present invention contains a modified polyolefin resin and an epoxy resin, and is characterized in that: the modified polyolefin resin is a resin that is obtained by graft-modifying an unmodified polyolefin resin with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the modified polyolefin resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin; and the dielectric constant of a cured product of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.
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Inventors:
OKIMURA YUYA (JP)
YAMADA MASASHI (JP)
YAMADA MASASHI (JP)
Application Number:
PCT/JP2015/072455
Publication Date:
March 31, 2016
Filing Date:
August 07, 2015
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J151/06; B32B27/00; C09J7/30; C09J123/26; C09J163/00; H05K1/03
Foreign References:
| JP2013091702A | 2013-05-16 | |||
| JP2004075853A | 2004-03-11 | |||
| JP2002088332A | 2002-03-27 | |||
| JPH08193148A | 1996-07-30 | |||
| JP2014218633A | 2014-11-20 | |||
| JP5700166B1 | 2015-04-15 |
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