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Title:
ADHESIVE COMPOSITION, AND ADHESIVE LAYER-EQUIPPED LAYERED PRODUCT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/172109
Kind Code:
A1
Abstract:
Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass% or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass% in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

Inventors:
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
YAMADA MASASHI (JP)
Application Number:
JP2019/008052
Publication Date:
September 12, 2019
Filing Date:
March 01, 2019
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J123/26; B32B15/08; B32B27/00; C09J7/30; C09J11/06; C09J123/10; H05K1/03
Domestic Patent References:
WO2016031342A12016-03-03
WO2017221801A12017-12-28
WO2016047289A12016-03-31
WO2017038615A12017-03-09
Foreign References:
JPH08193148A1996-07-30
JP2018135468A2018-08-30
JP2014205790A2014-10-30
JP2008214578A2008-09-18
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