Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION, AND ADHESIVE LAYER-EQUIPPED LAYERED PRODUCT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/172109
Kind Code:
A1
Abstract:
Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass% or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass% in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

Inventors:
OKIMURA Yuya (C/O TOAGOSEI CO. LTD, 8, Showa-cho, Minato-k, Nagoya-shi Aichi 26, 〒4550026, JP)
HIRAKAWA Makoto (C/O TOAGOSEI CO. LTD, 8, Showa-cho, Minato-k, Nagoya-shi Aichi 26, 〒4550026, JP)
YAMADA Masashi (C/O TOAGOSEI CO. LTD, 8, Showa-cho, Minato-k, Nagoya-shi Aichi 26, 〒4550026, JP)
Application Number:
JP2019/008052
Publication Date:
September 12, 2019
Filing Date:
March 01, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOAGOSEI CO., LTD. (1-14-1, Nishi-Shimbashi Minato-ku Tokyo, 19, 〒1058419, JP)
International Classes:
C09J123/26; B32B15/08; B32B27/00; C09J7/30; C09J11/06; C09J123/10; H05K1/03
Download PDF: