ADHESIVE COMPOSITION, AND ADHESIVE LAYER-EQUIPPED LAYERED PRODUCT USING SAME

WIPO Patent Application WO/2019/172109

A1

Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass% or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass% in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

JP3468897	PRODUCTION OF WATER-BASED COMPOSITION EMULSION OF CHLORINATED POLYOLEFIN-MODIFIED PRODUCT AND ITS USAGE
WO/2017/159707	THERMOPLASTIC ADHESIVE FILM
JP4061824	Rubber composition

OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
YAMADA MASASHI (JP)

PCT/JP2019/008052

September 12, 2019

March 01, 2019

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TOAGOSEI CO LTD (JP)

C09J123/26; B32B15/08; B32B27/00; C09J7/30; C09J11/06; C09J123/10; H05K1/03

WO2016031342A1	2016-03-03
WO2017221801A1	2017-12-28
WO2016047289A1	2016-03-31
WO2017038615A1	2017-03-09

JPH08193148A	1996-07-30
JP2018135468A	2018-08-30
JP2014205790A	2014-10-30
JP2008214578A	2008-09-18

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