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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, ADHESIVE SHEET, MULTILAYER BODY, JOINED BODY, METHOD FOR PRODUCING JOINED BODY, AND METHOD FOR DISMANTLING JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2024/043288
Kind Code:
A1
Abstract:
The present invention relates to an adhesive composition which contains a multifunctional epoxy resin, a monofunctional epoxy compound and a thermoplastic resin, wherein: the content ratio of the monofunctional epoxy compound with respect to the total amount of the multifunctional epoxy resin and the monofunctional epoxy compound is 20% by mass to 50% by mass; and the content of the thermoplastic resin in the adhesive composition is 20% by mass to 60% by mass relative to all resin components.

Inventors:
SUZUKI YUTO (JP)
UEDA SATOSHI (JP)
Application Number:
PCT/JP2023/030393
Publication Date:
February 29, 2024
Filing Date:
August 23, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J163/00; C09J7/38; C09J11/04
Foreign References:
JP2006225544A2006-08-31
JP2002030266A2002-01-31
JP2011114037A2011-06-09
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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