Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/101372
Kind Code:
A1
Abstract:
The present invention pertains to: an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer not having a functional group that reacts with the moisture-curable component, the water content of the base polymer after being stored at 25°C and 50% RH for 24 hours is 0.1 wt% or less, and the moisture-curing component is contained in an unreacted state; an adhesive layer comprising the adhesive composition; and an adhesive sheet having the adhesive layer.
Inventors:
KIRA YOSHIKO (JP)
TANI KENSUKE (JP)
ASAI RYOKO (JP)
SHIMOKAWA KAYO (JP)
OKADA KENICHI (JP)
TANI KENSUKE (JP)
ASAI RYOKO (JP)
SHIMOKAWA KAYO (JP)
OKADA KENICHI (JP)
Application Number:
PCT/JP2017/042927
Publication Date:
June 07, 2018
Filing Date:
November 29, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/00; C09J7/20; C09J11/06; C09J11/08; C09J121/00; C09J133/00
Domestic Patent References:
| WO2014115521A1 | 2014-07-31 |
Foreign References:
| JPS58171460A | 1983-10-08 | |||
| JP2002188071A | 2002-07-05 | |||
| JP2014231586A | 2014-12-11 | |||
| JP2009144068A | 2009-07-02 | |||
| JP2008163502A | 2008-07-17 | |||
| JPH09316228A | 1997-12-09 | |||
| JPH0211688A | 1990-01-16 | |||
| JP2001354749A | 2001-12-25 | |||
| JP2000273418A | 2000-10-03 | |||
| JP2016232749A | 2016-11-30 | |||
| JP2017229395A | 2017-11-29 |
Other References:
See also references of EP 3549994A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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