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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/101372
Kind Code:
A1
Abstract:
The present invention pertains to: an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer not having a functional group that reacts with the moisture-curable component, the water content of the base polymer after being stored at 25°C and 50% RH for 24 hours is 0.1 wt% or less, and the moisture-curing component is contained in an unreacted state; an adhesive layer comprising the adhesive composition; and an adhesive sheet having the adhesive layer.

Inventors:
KIRA YOSHIKO (JP)
TANI KENSUKE (JP)
ASAI RYOKO (JP)
SHIMOKAWA KAYO (JP)
OKADA KENICHI (JP)
Application Number:
JP2017/042927
Publication Date:
June 07, 2018
Filing Date:
November 29, 2017
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/00; C09J7/20; C09J11/06; C09J11/08; C09J121/00; C09J133/00
Domestic Patent References:
WO2014115521A12014-07-31
Foreign References:
JPS58171460A1983-10-08
JP2002188071A2002-07-05
JP2014231586A2014-12-11
JP2009144068A2009-07-02
JP2008163502A2008-07-17
JPH09316228A1997-12-09
JPH0211688A1990-01-16
JP2001354749A2001-12-25
JP2000273418A2000-10-03
JP2016232749A2016-11-30
JP2017229395A2017-11-29
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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