Title:
ADHESIVE COMPOSITION AND METHOD FOR PRODUCING BONDED BODY USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/085698
Kind Code:
A1
Abstract:
Provided are an adhesive composition capable of maintaining an applied shape after UV irradiation and having good adhesive strength after curing and a method for producing a bonded body using the same. The adhesive composition contains 45-70 mass% of an epoxy resin, a first (meth)acrylate component of at least one selected from the group consisting of aromatic (meth)acrylates, alicyclic (meth)acrylates, and heterocyclic (meth)acrylates, a second (meth)acrylate component composed of a hydroxyl group-containing (meth)acrylate, a radical photopolymerization initiator, and a cationic photopolymerization initiator. Also, the adhesive composition may contain from more than 30 mass% to 70 mass% of a hydrogenated epoxy resin, a first (meth)acrylate component of at least one selected from the group consisting of aromatic (meth)acrylates, alicyclic (meth)acrylates, and heterocyclic (meth)acrylates, a second (meth)acrylate component composed of a hydroxyl group-containing (meth)acrylate, a radical photopolymerization initiator, and a cationic photopolymerization initiator.
Inventors:
NAKAMURA TSUKASA (JP)
MURAMATSU WATARU (JP)
MURAMATSU WATARU (JP)
Application Number:
PCT/JP2021/038664
Publication Date:
April 28, 2022
Filing Date:
October 19, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08G59/68; C09J4/02; C09J5/00; C09J11/06; C09J163/00
Domestic Patent References:
| WO2017213025A1 | 2017-12-14 |
Foreign References:
| JPH10306140A | 1998-11-17 | |||
| JP2018165329A | 2018-10-25 | |||
| JP2018165330A | 2018-10-25 | |||
| JP2013035968A | 2013-02-21 | |||
| JP2014037477A | 2014-02-27 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro et al. (JP)
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