Title:
ADHESIVE COMPOSITION AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/224934
Kind Code:
A1
Abstract:
Provided is an adhesive composition containing a polymerizable compound, a thermal polymerization initiator, and a dicarboxylic acid diester compound.
More Like This:
| WO/2017/010766 | CROSSLINKING COMPOSITION |
| JP6009505 | 2 part hybrid adhesives |
| JPH0996092 | FLOOR FACE WITH PROTRUDED PART AND LAYING METHOD THEREOF |
Inventors:
OHKOSHI MASASHI (JP)
ITOH YUKA (JP)
TAKAGI SHUNSUKE (JP)
SATO MAYUMI (JP)
KIKUCHI KENTA (JP)
IZAWA HIROYUKI (JP)
ITOH YUKA (JP)
TAKAGI SHUNSUKE (JP)
SATO MAYUMI (JP)
KIKUCHI KENTA (JP)
IZAWA HIROYUKI (JP)
Application Number:
PCT/JP2022/018049
Publication Date:
October 27, 2022
Filing Date:
April 18, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/00; C09J9/02; C09J11/06; H05K3/32
Domestic Patent References:
| WO2014189028A1 | 2014-11-27 | |||
| WO2016190361A1 | 2016-12-01 | |||
| WO2002055625A1 | 2002-07-18 |
Foreign References:
| JP2006199937A | 2006-08-03 | |||
| JPH0495310A | 1992-03-27 | |||
| JP2017061599A | 2017-03-30 | |||
| JP2021024894A | 2021-02-22 | |||
| JPH03237174A | 1991-10-23 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: