Title:
ADHESIVE COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/053589
Kind Code:
A1
Abstract:
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connected together, or in a semiconductor device in which the connection parts of a plurality of semiconductor chips are electrically connected together, wherein the adhesive composition contains an epoxy resin, a curing agent, and a vinyl-based surface treatment filler.
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Inventors:
HONDA Kazutaka (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
本田 一尊 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
NAGAI Akira (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
本田 一尊 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
NAGAI Akira (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
Application Number:
JP2011/074153
Publication Date:
April 26, 2012
Filing Date:
October 20, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
HONDA Kazutaka (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
本田 一尊 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
HONDA Kazutaka (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
本田 一尊 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
International Classes:
C09J163/00; C09J11/04; C09J11/06; C09J179/08; C09J201/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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Claims: