Title:
ADHESIVE COMPOSITION AND METHOD FOR PRODUCING ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/013595
Kind Code:
A1
Abstract:
[Problem] To provide an epoxy-based adhesive having excellent properties such as tensile shear properties with a base material, curability, and heat resistance. [Solution] An adhesive composition containing an epoxy resin composition (A), a curing catalyst (B), and a thixotropic agent (C), the epoxy resin composition (A) including a reaction product (c) of an epoxy resin (a) and a compound (b) having a phenolic hydroxyl group. When the total of the epoxy resin (a), the compound (b) having a phenolic hydroxyl group (b), and the reaction product (c) is taken to be 100% in the area ratio measured by gel permeation chromatography, the area ratio of the reaction product (c) is more than 2.0% and 10% or less.
Inventors:
SHIBA TAKUYA (JP)
Application Number:
PCT/JP2022/029519
Publication Date:
February 09, 2023
Filing Date:
August 01, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J163/00; C09D7/61; C09D7/63
Foreign References:
| JP2006063227A | 2006-03-09 | |||
| JP2015187271A | 2015-10-29 | |||
| JP2013108011A | 2013-06-06 | |||
| JPH05148337A | 1993-06-15 |
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