Title:
ADHESIVE COMPOSITION AND METHOD FOR SELECTING SAME, ADHESIVE FILM AND METHOD FOR PRODUCING SAME, AND ADHESIVE BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/261501
Kind Code:
A1
Abstract:
Disclosed is a method for selecting an adhesive composition containing a thermoplastic resin, a thermosetting resin, and a cationic polymerization initiator. This method for selecting an adhesive composition includes a step for determining that an adhesive composition is good if the calorific value of a heated product is 10% or less of the calorific value of the adhesive composition, when the calorific value of the adhesive composition and the calorific value of the heated product obtained by heating the adhesive composition at 90°C for 2 hours are measured by means of differential scanning calorimetry under the conditions of a measurement temperature range of 30-300°C and a heating rate of 10 °C/min.
Inventors:
KIMURA RYOSUKE (JP)
TANIGUCHI KOUHEI (JP)
TANIGUCHI KOUHEI (JP)
Application Number:
PCT/JP2019/025686
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J201/00; C09J11/04; C09J163/00; C09J163/02
Domestic Patent References:
| WO2019022062A1 | 2019-01-31 | |||
| WO2018092463A1 | 2018-05-24 |
Foreign References:
| JP2018104653A | 2018-07-05 | |||
| JP2016169337A | 2016-09-23 | |||
| JP2008133391A | 2008-06-12 | |||
| JP2013216820A | 2013-10-24 | |||
| JPH10273635A | 1998-10-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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