ADHESIVE COMPOSITION FOR ORGANIC FIBER CORDS, RUBBER-REINFORCING MATERIAL USING SAME, TIRE AND BONDING METHOD

Title:

ADHESIVE COMPOSITION FOR ORGANIC FIBER CORDS, RUBBER-REINFORCING MATERIAL USING SAME, TIRE AND BONDING METHOD

Document Type and Number:

WIPO Patent Application WO/2010/125992

Kind Code:

A1

Abstract:

Disclosed are: an adhesive composition for organic fiber cords, which does not contain resorcin and formalin, and has good adhesiveness and good environment performance, in particular good working environment performance; a rubber-reinforcing material using the adhesive composition for organic fiber cords; a tire; and a bonding method. Specifically disclosed are: an adhesive composition for organic fiber cords, which contains (A) a (blocked) isocyanate compound and/or an amine-based curing agent, (B) an epoxy compound and (C) a rubber latex; a rubber-reinforcing material using the adhesive composition for organic fiber cords; a tire; and a bonding method. It is preferable that the ratio of the mass (a) of (A) the (blocked) isocyanate compound and/or the amine-based curing agent to the mass (b) of (B) the epoxy compound, namely (mass of (blocked) isocyanate compound and/or amine-based curing agent/mass of epoxy compound) a/b is not less than 0.1 but not more than 30.

Inventors:

IKEDA YUJI (JP)
GIZA EMIL (JP)

Application Number:

PCT/JP2010/057332

Publication Date:

November 04, 2010

Filing Date:

April 26, 2010

Export Citation:

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Assignee:

BRIDGESTONE CORP (JP)
IKEDA YUJI (JP)
GIZA EMIL (JP)

International Classes:

D06M13/395; D06M13/11; D06M15/693; D06M101/32; D06M101/34

Domestic Patent References:

WO2007072703A1

2007-06-28

Foreign References:

JP2006037251A	2006-02-09
JP2008169504A	2008-07-24
JPH03163181A	1991-07-15
JPS582370A	1983-01-07
JPS6092371A	1985-05-23
JPS6096674A	1985-05-30
JPS63249784A	1988-10-17
JPS6361433A	1988-03-17
JPH03163181A	1991-07-15

Other References: