Title:
ADHESIVE COMPOSITION FOR PLYWOOD, METHOD FOR PRODUCING PLYWOOD, AND PLYWOOD
Document Type and Number:
WIPO Patent Application WO/2011/138858
Kind Code:
A1
Abstract:
Disclosed is a method for producing plywood wherein an adhesive composition for plywood formed by adding 1 - 15 parts by mass of acacia bark powder, 25 - 70 parts by mass of an inorganic filler, and 10 - 50 parts by mass of water to 100 parts by mass of an aqueous solution of a resole type phenol resin for which the resin part is 40 - 50% by mass is applied to single sheets, a plurality of single sheets layered and the plywood produced by applying pressure and heat. Specifically disclosed is an adhesive composition for plywood that controls puncture phenomena and dry-out problems in plywood production by controlling increases in viscosity after the preparation of the adhesive composition for plywood when single sheets with normal or low water content are used and even when single sheets with high water content are used. Also disclosed are a method for producing plywood using this adhesive composition for plywood and plywood produced by this method.
Inventors:
SHIMIZU, Ken (2-158, Hirabayashikita 1-chome, Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
清水 賢 (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号株式会社コシイウッドソリューションズ内 Osaka, 〒5590026, JP)
KAWAI, Fumio (2-158, Hirabayashikita 1-chome, Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
清水 賢 (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号株式会社コシイウッドソリューションズ内 Osaka, 〒5590026, JP)
KAWAI, Fumio (2-158, Hirabayashikita 1-chome, Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
Application Number:
JP2011/002482
Publication Date:
November 10, 2011
Filing Date:
April 27, 2011
Export Citation:
Assignee:
KOSHII WOOD SOLUTIONS CO., LTD. (2-158, Hirabayashikita 1-chome Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
株式会社コシイウッドソリューションズ (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号 Osaka, 〒5590026, JP)
SHIMIZU, Ken (2-158, Hirabayashikita 1-chome, Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
清水 賢 (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号株式会社コシイウッドソリューションズ内 Osaka, 〒5590026, JP)
株式会社コシイウッドソリューションズ (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号 Osaka, 〒5590026, JP)
SHIMIZU, Ken (2-158, Hirabayashikita 1-chome, Suminoe-ku, Osaka-sh, Osaka 26, 〒5590026, JP)
清水 賢 (〒26 大阪府大阪市住之江区平林北一丁目２番１５８号株式会社コシイウッドソリューションズ内 Osaka, 〒5590026, JP)
International Classes:
C09J161/06; B27D1/10; B32B21/14; B32B27/00; C09J5/00; C09J11/04; C09J11/06; C09J129/04
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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Claims:
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