ADHESIVE COMPOSITION AND PRINTED WIRING BOARD - SUMITOMO ELECTRIC INDUSTRIES

Title:

ADHESIVE COMPOSITION AND PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2018/092452

Kind Code:

A1

Abstract:

Provided is an adhesive composition which contains: a poly(vinyl acetal) or polyethersulfone; a phenoxy resin; and a novolac type epoxy resin. The glass transition temperature of the phenoxy resin is 90-140°C.

Inventors:

YONEZAWA TAKAYUKI (JP)
KAIMORI SHINGO (JP)
YAMAUCHI MASAAKI (JP)
ISHII YUKI (JP)

Application Number:

PCT/JP2017/036118

Publication Date:

May 24, 2018

Filing Date:

October 04, 2017

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)

International Classes:

C09J163/02; C09J11/08; C09J129/14; C09J163/04; C09J181/06; H05K1/03

Domestic Patent References:

WO2010061980A1

2010-06-03

Foreign References:

JP2011089038A	2011-05-06
JP2006022230A	2006-01-26
US20040213980A1	2004-10-28
JP2010102859A	2010-05-06
JP2010024384A	2010-02-04
JP2013221144A	2013-10-28

Attorney, Agent or Firm:

NAKATA Motomi et al. (JP)

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