Title:
ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM, COVERLAY, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2015/037555
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an adhesive composition for printed wiring boards, which exhibits excellent heat resistance. Another purpose of the present invention is to provide: a coverlay for printed wiring boards, which uses this adhesive composition for printed wiring boards; a copper-clad laminate; and a printed wiring board. The present invention is an adhesive composition for printed wiring boards, in which a siloxane-modified polyimide having structural units represented by formula (1) and formula (2), an epoxy resin and an inorganic filler are blended, and wherein the siloxane-modified polyimide has a weight average molecular weight (Mw) of from 25,000 to 150,000 (inclusive) and from 10 parts by mass to 100 parts by mass (inclusive) of the inorganic filler is blended per 100 parts by mass of the siloxane-modified polyimide. In formula (1) and formula (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue; m represents a number from 0.35 to 0.75 (inclusive); n represents a number from 0.25 to 0.65 (inclusive); R1 in formula (1) represents a divalent diamine siloxane residue; and R2 in formula (2) represents a divalent aromatic diamine residue.
Inventors:
YONEZAWA TAKAYUKI (JP)
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
ASAI SHOGO (JP)
UCHITA YOSHIFUMI (JP)
KAKIMOTO MASAYA (JP)
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
ASAI SHOGO (JP)
UCHITA YOSHIFUMI (JP)
KAKIMOTO MASAYA (JP)
Application Number:
PCT/JP2014/073647
Publication Date:
March 19, 2015
Filing Date:
September 08, 2014
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
International Classes:
H05K3/28; B32B15/08; B32B27/00; C09J7/10; C09J179/08
Foreign References:
| JP2009029982A | 2009-02-12 | |||
| JP2011190425A | 2011-09-29 | |||
| JP2000223805A | 2000-08-11 | |||
| JP2011190425A | 2011-09-29 | |||
| JP2011157440A | 2011-08-18 | |||
| JP2003213241A | 2003-07-30 | |||
| JP2000226566A | 2000-08-15 |
Other References:
See also references of EP 3046402A4
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
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