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Patent Searching and Data


Title:
ADHESIVE COMPOSITION FOR PROTECTIVE FILM OF COATED SURFACE AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2014/087815
Kind Code:
A1
Abstract:
[Problem] To provide: an adhesive composition that is for a protective film and that suppresses glue residue and surface contamination at a coated surface; and a method for preparing the adhesive composition. [Solution] The adhesive composition for a protective film of a coated surface contains 1-20 parts by weight of a predetermined polar adhesive resin compound for every 100 parts by weight of a predetermined block copolymer, and the solubility parameter of the polar adhesive resin compound calculated by means of Small's method using the constants of Hoy is 8.2-9.2 inclusive.

Inventors:
MASUKO NORIO (JP)
KATO HIROSHI (JP)
Application Number:
PCT/JP2013/080508
Publication Date:
June 12, 2014
Filing Date:
November 12, 2013
Export Citation:
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Assignee:
KRATON POLYMERS US LLC (US)
MASUKO NORIO (JP)
KATO HIROSHI (JP)
International Classes:
C09J153/02; C09J7/02; C09J193/00
Domestic Patent References:
WO2007126081A12007-11-08
WO2010029773A12010-03-18
WO2003064527A22003-08-07
WO2003064528A22003-08-07
Foreign References:
JP2009520042A2009-05-21
JP2008274211A2008-11-13
JP2002167567A2002-06-11
JP2001342448A2001-12-14
JP2012001630A2012-01-05
JP2011202146A2011-10-13
USRE27145E1971-06-22
Other References:
K. L. HOY: "New values of the solubility parameters from vapor pressure data", J. PAINT TECHN., vol. 42, no. 541, 1970, pages 76, XP008010125
K. L. HOY: "The Hoy tables of solubility parameters", 1985, UNION CARBIDE CORP.
K. L. HOY: "Solubility Parameters as a design parameter for water borne polymers and coatings", PREPRINTS 14TH INT. CONF. ATHENE, 1988
K. L. HOY, J. COATED FABRICS, vol. 19, 1989, pages 53
KIRK-OTHMER: "Encyclopaedia of Chemical Technology", vol. 19, 1996, article "plastic processing", pages: 290 - 316
Attorney, Agent or Firm:
Kawaguti & Partners (JP)
In the patent business corporation Kawaguchi 國 case, it is a patent firm. (JP)
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