Title:
ADHESIVE COMPOSITION, SEALING SHEET, AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2017/094591
Kind Code:
A1
Abstract:
The present invention is: an adhesive composition containing an (A) component that is a modified polyolefin resin, a (B) component that is a multifunctional epoxy compound, and a (C) component that is an imidazole curing catalyst; a sealing sheet comprising an adhesive layer that is formed using the adhesive composition; and a sealed body obtained by sealing an object to be sealed with the sealing sheet. The present invention provides an adhesive composition having excellent adhesive strength, a sealing sheet that is formed using the adhesive composition and that comprises an adhesive layer having excellent sealing performance, and a sealed body obtained by sealing an object to be sealed with the sealing sheet.
Inventors:
NISHIJIMA KENTA (JP)
HASEGAWA TATSUKI (JP)
HASEGAWA TATSUKI (JP)
Application Number:
PCT/JP2016/084833
Publication Date:
June 08, 2017
Filing Date:
November 24, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; C09J123/26; C09J7/10; C09J7/30; C09J7/35; C09J7/40; C09J11/06; C09J163/00; H01L51/50; H05B33/04
Domestic Patent References:
| WO2011062167A1 | 2011-05-26 | |||
| WO2013147156A1 | 2013-10-03 |
Foreign References:
| JP2008163344A | 2008-07-17 | |||
| JP2015059198A | 2015-03-30 | |||
| JP2015137333A | 2015-07-30 | |||
| JP2012106421A | 2012-06-07 | |||
| JP2013226757A | 2013-11-07 |
Other References:
See also references of EP 3385349A4
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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