Title:
ADHESIVE COMPOSITION, SEALING SHEET, AND SEALED BODY
Document Type and Number:
WIPO Patent Application WO/2018/047920
Kind Code:
A1
Abstract:
Provided is an adhesive composition containing a component (A) being a modified polyolefin resin and a component (B) being a polyfunctional epoxy compound, said adhesive composition being characterized by having no more than 20 mg of outgas per 1 cm3 solid content, when the outgas content of the solid content is measured at 120°C for 20 minutes. Also provided are: a sealing sheet having an adhesive layer formed using this adhesive composition; and a sealed body comprising an object-to-be-sealed that has been sealed by this sealing sheet. As a result of the present invention, provided are: an adhesive composition that is readily molded into a sheet shape and has low outgas properties; a sealing sheet having an adhesive layer formed using this adhesive composition and having low outgas properties; and a sealed body comprising an object-to-be-sealed that has been sealed using the sealing sheet.
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Inventors:
NISHIJIMA KENTA (JP)
HASEGAWA TATSUKI (JP)
HASEGAWA TATSUKI (JP)
Application Number:
PCT/JP2017/032360
Publication Date:
March 15, 2018
Filing Date:
September 07, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J123/26; B32B27/00; B32B27/32; B32B27/38; C09J7/00; C09J11/06; C09J11/08; C09J163/00; G02F1/1339; H01L31/048; H01L51/50; H05B33/04
Domestic Patent References:
WO2016031342A1 | 2016-03-03 | |||
WO2013137397A1 | 2013-09-19 | |||
WO2016075975A1 | 2016-05-19 |
Foreign References:
JP2013091702A | 2013-05-16 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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