Title:
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/093114
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive composition in which recognition of an alignment mark is possible, solder wettability of a joining section is adequately ensured, and suppression of void occurrence is excellent. The present invention is an adhesive composition containing (A) a polymer compound, (B) an epoxy compound having a weight-average molecular weight of 100-3000, (C) flux, and (D) inorganic particles that have an average particle diameter of 30 to 200 nm and that have on their surface an alkoxysilane having a phenyl group, the adhesive composition being characterized in that the (C) flux contains an acid-modified rosin.
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Inventors:
MATSUMURA KAZUYUKI (JP)
FUJIMARU KOICHI (JP)
KANAMORI DAISUKE (JP)
FUJIMARU KOICHI (JP)
KANAMORI DAISUKE (JP)
Application Number:
PCT/JP2015/083758
Publication Date:
June 16, 2016
Filing Date:
December 01, 2015
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J163/00; C09J11/04; C09J11/06; C09J171/10; C09J201/00; H01L21/60; H05K1/14
Domestic Patent References:
| WO2014103637A1 | 2014-07-03 |
Foreign References:
| JP2012190924A | 2012-10-04 | |||
| JP2014107321A | 2014-06-09 | |||
| JP2014140006A | 2014-07-31 |
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