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Title:
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/087971
Kind Code:
A1
Abstract:
　This adhesive composition includes silver particles containing silver atoms, zinc particles containing metallic zinc, and a thermosetting resin.

Inventors:
NATORI MICHIKO (JP)
TANAKA TOSHIAKI (JP)
NAKAKO HIDEO (JP)
ISHIKAWA DAI (JP)
YAMADA KAZUHIKO (JP)
FUJITA MASARU (JP)
OKADA CHIAKI (JP)
Application Number:
PCT/JP2014/082839
Publication Date:
June 18, 2015
Filing Date:
December 11, 2014
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J1/00; C09J9/02; C09J11/04; H01B1/22; H01L33/62
Domestic Patent References:
WO2013094543A12013-06-27
WO2012043545A12012-04-05
WO2008139763A12008-11-20
WO2013187518A12013-12-19
Foreign References:
JP2002150838A2002-05-24
JP2005225980A2005-08-25
JP2008106145A2008-05-08
JPH06329960A1994-11-29
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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