Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTORS, AND ADHESIVE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/091306
Kind Code:
A3
Abstract:
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350°C, wherein less than 10% of the composition, which is cured at 150°C for 10 minutes, cured at 150°C for 30 minutes, and then molded at 175°C for 60 seconds, consists of voids. The adhesive composition for semiconductors is characterized by enabling a reduction in and the skipping of semi-curing steps, which would be necessary to perform after bonding the same type of chips.
Inventors:
PARK BAEK SOUNG (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
Application Number:
PCT/KR2011/009301
Publication Date:
September 07, 2012
Filing Date:
December 02, 2011
Export Citation:
Assignee:
CHEIL IND INC (KR)
PARK BAEK SOUNG (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
PARK BAEK SOUNG (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
International Classes:
C09J9/00; C09J7/10; C09J11/00; C09J163/00; C09J201/00
Domestic Patent References:
WO2006107792A1 | 2006-10-12 |
Foreign References:
KR20100077792A | 2010-07-08 | |||
KR20080113670A | 2008-12-31 |
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (Hubbahubba Building 648 Yeoksam-dong, Gangnam-gu, Seoul 135-911, KR)
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Claims:
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