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Patent Searching and Data


Title:
ADHESIVE COMPOSITION FOR SEMICONDUCTORS, AND ADHESIVE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/091306
Kind Code:
A3
Abstract:
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350°C, wherein less than 10% of the composition, which is cured at 150°C for 10 minutes, cured at 150°C for 30 minutes, and then molded at 175°C for 60 seconds, consists of voids. The adhesive composition for semiconductors is characterized by enabling a reduction in and the skipping of semi-curing steps, which would be necessary to perform after bonding the same type of chips.

Inventors:
PARK BAEK SOUNG (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
Application Number:
PCT/KR2011/009301
Publication Date:
September 07, 2012
Filing Date:
December 02, 2011
Export Citation:
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Assignee:
CHEIL IND INC (KR)
PARK BAEK SOUNG (KR)
SONG KI TAE (KR)
UH DONG SEON (KR)
KIM IN HWAN (KR)
International Classes:
C09J9/00; C09J7/10; C09J11/00; C09J163/00; C09J201/00
Domestic Patent References:
WO2006107792A12006-10-12
Foreign References:
KR20100077792A2010-07-08
KR20080113670A2008-12-31
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (Hubbahubba Building 648 Yeoksam-dong, Gangnam-gu, Seoul 135-911, KR)
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Claims: