Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/131575
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition which enables the formation of a film-like adhesive that has highly satisfactory adhesion to semiconductor wafers, wafer back grinding properties, and burying properties during flip chip bonding. Specifically disclosed is an adhesive composition which contains (A) a thermoplastic resin having a weight average molecular weight of not less than 20,000 but not more than 100,000, (B) an epoxy resin, (C) a radiation polymerizable compound, (D) a photoinitiator, and (E) a microcapsule-type curing accelerator.
Inventors:
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
NAGAI AKIRA (JP)
Application Number:
PCT/JP2010/057472
Publication Date:
November 18, 2010
Filing Date:
April 27, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
OOKUBO KEISUKE (JP)
NAGAI AKIRA (JP)
International Classes:
C09J163/00; C09J4/00; C09J7/35; C09J11/06; C09J201/00; H01L21/60
Domestic Patent References:
| WO2009008448A1 | 2009-01-15 |
Foreign References:
| JP2005235530A | 2005-09-02 | |||
| JP2005235956A | 2005-09-02 | |||
| JP2003238925A | 2003-08-27 | |||
| JPH1135699A | 1999-02-09 | |||
| JP2008068324A | 2008-03-27 | |||
| JP2006049482A | 2006-02-16 | |||
| JP2005144745A | 2005-06-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: