Title:
ADHESIVE COMPOSITION AND ADHESIVE SHEET, AND CURED MATERIAL AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/115637
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).
Inventors:
SHIMADA AKIRA (JP)
AOKI KOICHI (JP)
AOKI KOICHI (JP)
Application Number:
PCT/JP2014/050684
Publication Date:
July 31, 2014
Filing Date:
January 16, 2014
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J179/08; C09J11/04; C09J163/00; H01L21/52
Domestic Patent References:
WO2012073851A1 | 2012-06-07 | |||
WO2011089922A1 | 2011-07-28 |
Foreign References:
KR20090063543A | 2009-06-18 | |||
JP2011063678A | 2011-03-31 | |||
JPH11222522A | 1999-08-17 | |||
JP2008266378A | 2008-11-06 | |||
JP2005113059A | 2005-04-28 | |||
JP2012126762A | 2012-07-05 |
Other References:
See also references of EP 2949719A4
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