Title:
ADHESIVE COMPOSITION, AND ADHESIVE SHEET, LAYERED BODY AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2024/090291
Kind Code:
A1
Abstract:
Provided are an adhesive composition that has excellent adhesion and solder heat resistance, exerts excellent adhesion even after being exposed to high temperatures for a long period of time, and has good circuit embeddability while suppressing excessive resin flow, and an adhesive sheet, a layered body and a printed circuit board containing the adhesive composition. The adhesive composition contains a polyester resin (A) and an epoxy resin (B); the epoxy resin (B) contains at least two types of epoxy resins (b) having nitrogen atoms; and one of the two types is the following epoxy resin (b1) and the other is the following epoxy resin (b2). (b1) A resin having a functionality of 3 or less. (b2) A resin having a functionality of 4 or more.
Inventors:
SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2023/037559
Publication Date:
May 02, 2024
Filing Date:
October 17, 2023
Export Citation:
Assignee:
TOYOBO MC CORP (JP)
International Classes:
C09J167/00; C09J7/35; C09J11/06; C09J163/00; H05K1/03
Foreign References:
| JP2014141603A | 2014-08-07 | |||
| JP7120498B1 | 2022-08-17 | |||
| JP2022051543A | 2022-03-31 | |||
| JP2019038929A | 2019-03-14 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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