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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ADHESIVE MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2009/119885
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition, characterized by comprising a mixture of a hot-melt adhesive with a ferromagnetic material and having a shear force of not less than 20 N after heat (150°C, 10 min) bonding. Also disclosed is an adhesive sheet produced from the adhesive composition. Further disclosed is an adhesive molded product characterized in that the adhesive molded product comprises a mixture of a hot-melt adhesive with a ferromagnetic material, has a shear force of not less than 20 N after heat (150°C, 10 min) bonding, and is used for bonding between components formed of a ferromagnetic material. The adhesive composition, the adhesive sheet, and the adhesive molded product can also be applied to fields where solvent resistance and chemical resistance are required.

Inventors:
YAGUCHI SHIGEYUKI (JP)
ONO YOSHITOMO (JP)
Application Number:
PCT/JP2009/056770
Publication Date:
October 01, 2009
Filing Date:
March 25, 2009
Export Citation:
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Assignee:
LINTEC CORP (JP)
HONDA MOTOR CO LTD (JP)
YAGUCHI SHIGEYUKI (JP)
ONO YOSHITOMO (JP)
International Classes:
C09J201/00; C09J7/35; C09J11/04; C09J123/00; C09J167/00
Foreign References:
JPS54126241A1979-10-01
JPS62225579A1987-10-03
JP2004506065A2004-02-26
JPH0493381A1992-03-26
JPH02114484A1990-04-26
JPS61171783A1986-08-02
JPH05340058A1993-12-21
JPH0423629Y21992-06-02
JPH05311134A1993-11-22
JP2000191987A2000-07-11
Attorney, Agent or Firm:
ORIGUCHI, Shingo (14-7 Nishishinbashi 1-chom, Minato-ku Tokyo 03, JP)
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