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Patent Searching and Data


Title:
ADHESIVE COMPOSITION AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/181589
Kind Code:
A1
Abstract:
An adhesive composition which contains (a) a thermoplastic resin having a urethane bond, (b) a radically polymerizable compound, (c) a radical polymerization initiator, (d) polyurethane beads and (e) non-conductive inorganic fine particles.

Inventors:
KUDOU Sunao (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
KAWABATA Yasunori (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
MISHIMA Shota (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
MORIJIRI Tomoki (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
Application Number:
JP2018/012994
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL COMPANY, LTD. (9-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 06, 〒1006606, JP)
International Classes:
C09J175/04; C09J4/06; C09J9/02; C09J11/04; C09J11/06; C09J11/08
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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