Title:
ADHESIVE COMPOSITION AND SURFACE PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/110368
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive composition that is capable of maintaining the transparency of an object to which a surface protective film is bonded even under high temperature high humidity conditions, while maintaining adequate curability even in cases where the film thickness is small. An adhesive composition according to the present invention contains (A) a urethane resin, (B) a curing agent and (C) a phosphorus curing accelerator, and is characterized in that: the urethane resin (A) has an acid group; the curing agent (B) contains an epoxy curing agent that has two or more epoxy groups in each molecule and an isocyanate curing agent that has two or more isocyanate groups in each molecule; and the phosphorus curing accelerator (C) is composed of a phosphonium salt.
Inventors:
SATO KOJI (JP)
HIGESHIRO TOMOKAZU (JP)
KOMATSUZAKI YUKI (JP)
HIGESHIRO TOMOKAZU (JP)
KOMATSUZAKI YUKI (JP)
Application Number:
PCT/JP2019/029197
Publication Date:
June 04, 2020
Filing Date:
July 25, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J175/04; B32B27/00; B32B27/40; C08G18/34; C09J7/24; C09J7/25; C09J7/38; C09J11/06
Domestic Patent References:
| WO2017126568A1 | 2017-07-27 | |||
| WO2017010158A1 | 2017-01-19 |
Foreign References:
| JP2010144058A | 2010-07-01 | |||
| JP6292429B1 | 2018-03-14 | |||
| JP2016186029A | 2016-10-27 | |||
| JP2010180290A | 2010-08-19 | |||
| JP2011026418A | 2011-02-10 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
Download PDF: