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Title:
ADHESIVE COMPOSITION AND ADHESIVE TAPE FOR LASER BONDING
Document Type and Number:
WIPO Patent Application WO/2014/033770
Kind Code:
A1
Abstract:
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive composition occurs as interfacial peeling; and in that when the temperature of the adhesive composition is 100 °C, the 180° peel adhesion strength from a stainless steel plate is 10 N/25 mm or lower and failure of the adhesive composition occurs as interfacial peeling.

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Inventors:
YAMADA KOSAKU (JP)
MURAKAMI HIROFUMI (JP)
FUJITA KAZUYA (JP)
Application Number:
PCT/JP2012/005362
Publication Date:
March 06, 2014
Filing Date:
August 27, 2012
Export Citation:
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Assignee:
HAYAKAWA RUBBER (JP)
YAMADA KOSAKU (JP)
MURAKAMI HIROFUMI (JP)
FUJITA KAZUYA (JP)
International Classes:
C09J201/00; C09J7/20; C09J153/02
Domestic Patent References:
WO2008044349A12008-04-17
Foreign References:
JPH10509748A1998-09-22
JP2001279212A2001-10-10
JP2004137297A2004-05-13
JP2010077372A2010-04-08
JPH0860121A1996-03-05
JPH0860120A1996-03-05
JP2009155402A2009-07-16
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
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